High-Accuracy Imaging

  Equipped with a 3 Megapixel Flat Panel Detector

Detailed internal structure and defects can be revealed due to the 3 megapixel flat panel detector (2.3 times larger than previously.

  New HDR Processing Function

Shimadzu’s unique, proprietary image processing technique/algorithm allows fluoroscopic images with a higher dynamic range, Regions that are both easy and difficult to penetrate can be observed at the same time, which shortens inspection times.

Simple Operation

  Imaging in Three Steps

Fluoroscopic imaging in just three steps.
A large monitor screen and simple button layout provide excellent visibility for intuitive operation.
X-ray inspections are easy to perform, even for operators using the system for the first time.

  Switch Smoothly between Fluoroscopy and CT

Switch between fluoroscopy and CT imaging by simply clicking on the menu tab.
The Xslicer SMX-6010 features tilted CT imaging. X-ray fluoroscopic images are captured and cross-sectional images are created by tilting the flat panel detector and rotating it 360 degrees. There is no need to install a separate unit for CT imaging.
The CT imaging scan conditions are easy to configure just by selecting the scan mode, scan angle, and scan region.
A region of interest in the fluoroscopic image can be observed immediately with a CT scan.

  High-Speed Imaging and High-Speed Reconstruction

The calibration procedures are completely automated to speed up the imaging process.
Cross-sectional images can be displayed in as little as two minutes after CT imaging starts.

  Wide CT Imaging Range

CT images can be obtained at any position within a 350 mm x 350 mm area. There is no need to move the sample to the center of the rotary table as in conventional tilted CT, allowing the scan to be positioned just by clicking on the scanning site.

  Set Tracking Points Easily

If a tracking point is set, the observation position of interest when tilted and rotated never leaves the center of the window.
As a result, the point of interest is never lost.
To set a tracking point, simply tilt the detector and double click the position of interest.

Versatile, User-Friendly Functions

  Teaching Function

Fluoroscopic and CT imaging can be automated using the Teaching Function, which moves the sample stage to preregistered points of interest.
Additionally, for visual inspection, OK and NG judgment functions are included.

  Stepwise Movement

The Stepwise Movement function moves the stage at constant intervals. It specifies the starting position, amount of movement, and number of movements. When this function is used, observations are performed while the stage makes consecutive movements from the starting position in accordance with the settings. Consecutive fluoroscopic or CT scans can be performed of samples arranged at set intervals.

  Panoramic Imaging Function

A wide-range fluoroscopic image can be obtained just by specifying the imaging span on the external image. An improved stitching process ensures there are no visible lines in the panoramic image where the individual images are joined. A fluoroscopic image up to 32 megapixels in size can be obtained.

  Image Adjustment Functions (Auto Window Function and Region of Interest Function)

The contrast can be automatically optimized to make the area of interest easy to see. Normally, with this sort of optimization function, the part outside the region of interest becomes difficult to see. However, a proprietary image processing algorithm automatically adjusts the image to ensure that the part outside the region of interest remains as easy to see as possible.

  Ball Grid Array (BGA) Measurements

BGA bump diameters and void ratios can be measured.
With our proprietar y image proces sing algorithm, compl icated parameter set tings are unnecessary.*
Multiple settings can be saved and applicable ones can be accessed for each inspection target prior to measurement.
* Manual adjustments may be required depending on the sample.

  Area Ratio Measurements

Die bonds, solder paste wettability, and other area ratios can be measured.
The parameter settings are not required thanks to Shimadzu’s proprietary image processing algorithm.*
It is also possible to save multiple settings, and then call up the applicable settings for each inspection target prior to measurement. Furthermore, pass/fail determinations can be made based on the area ratio.
* Manual adjustments may be required depending on the sample.
* The measurement range (ROI) can be configured manually.

  Wire Sweep Ratio Measurements

The wire sweep ratio can be measured by specifying both ends of the bonding wire and the point of maximum curvature.
Pass/fail determinations can be made depending on the wire sweep ratio.

  Dimension Measurements

The Xslicer SMX-6010 supports both 2-point distance and 3-point measurements.
With this system, sizes are measured efficiently by calculating calibration data internally in synchronization with the fluoroscopic magnification.

System Configuration

  An easy-to-maintain
Shimadzu X-ray generator and various safety mechanisms
reduce costs and ensure safe use.

X-Ray Generator

The Xslicer SMX-6010 features a160-kV open tube and can resolve down to 1 micron.
Due to the integrated high-voltage transformer, no greasing is necessary.
The filament replacement process is simplified by automatic adjustments.
Note: 1 µm resolution by JIMA chart analysis.

X-Ray Detector

Equipped with a 3 megapixel flat panel detector.

Five-Axis Stage

In addition to the X, Y, and Z axes of the sample stage, the detector tilts and rotates.
Five-axis movement supports inspections from any angle.

X-Ray Shield Box

The X-rays are well shielded. (Maximum 1 Sv/h external X-ray leakage)
The front door lock mechanism prevents the front door from opening during X-ray emission.
The interlock mechanism also disables movement of the 5-axis stage when the door is open.

Collision Sensor

A collision sensor is provided around the X-ray detector to stop the Stage in the event of an emergency (a collision with the sample).

Utilities

System operation requires only the following: 200 V AC ± 10 %, 1.5 kVA (ground resistance 100 Ω max.) There is no need to provide air or cooling water.

Principles and Features of Planer CT Imaging

  Capable of Maximum Image Enlargement for Planer Samples

■Planer CT

Scanning large circuit boards
with planer CT:

The sample is mounted on an XY stage, so it can approach the X-ray generator, enabling maximum image enlargement.

■Vertical CT

Vertical CT Viewed from above the Rotary Table

Scanning large circuit boards
with vertical CT:

When the sample is brought near the X-ray generator to increase the magnification, it will be obstructed by the X-ray generator during CT imaging, making imaging at maximum magnification impossible.

  Observation Examples

For samples like circuit boards with planer CT, images with a high magnification can be obtained, unlike with orthogonal CT, which is affected by the width of the sample.

High Image Quality Exceeding the Level of General-Purpose Models

  Equipped with ultra-high-resolution 3 megapixel flat panel detector*

*Xslicer SMX-1020

The Xslicer SMX-1020 is equipped with a 3 megapixel flat panel detector. Users can assess internal structures or defects in detail
while observing a wide field of view.
The Xslicer SMX-1020 can inspect sizes with twice the field of view as the SMX-1010.

  New HDR Processing Function

Shimadzu’s unique, proprietary image processing technique/algorithm allows fluoroscopic images with a higher dynamic range. Regions that are both easy and difficult to penetrate can be observed at the same time, which shortens inspection times.

Software Significantly Shortens Inspection Times

  Inspections Start in 3 Steps and 5 Seconds

Just a 3-step process before starting observations. After the start button is clicked, X-ray emission and exterior camera imaging are
automatic. X-ray fluoroscopic imaging can start 5 seconds after sample placement (4.6 times faster than the previous model).

Simple Operation

  Simple UI and Easy Positioning Operations

A large monitor screen and simple button layout provide excellent visibility for intuitive operability. X-ray inspections can be performed easily, even by operators using the system for the first time.

  Faster Detector Acquisition and Stage Movements

The flat panel detector acquisition is 4× faster than the previous model, and the stage movement (XY direction) is 1.6× faster. In addition to ordinary use, this contributes to faster tact times during consecutive inspections.

  Example of Continuous Inspections Using the Step Feed Function

Inspection times were compared for consecutive X-ray inspections of 25 samples using the step feed function on the previous SMX-1000 Plus and the SMX-1020. Inspection times are approximately 40 % shorter in comparison to the SMX-1000 Plus.
Additionally, X-ray emission times are reduced by at least 35 %, which also reduces running costs. The time reduction ratio increases as the number of samples increases.

Samples arranged at fixed intervals can be observed consecutively. The starting position, movement amount, and number of movements can be specified. During implementation, consecutive movements and observations are made in accordance with the settings from the start position. After the inspection, a table of the pass/ fail/hold results can be displayed.

  Inspections with the Xslicer SMX-1020 Take Half the Time of the Xslicer SMX-1010

The Xslicer SMX-1020 can inspect twice the horizontal area of the SMX-1010. The area in a single inspection is twice the size, so the inspection takes about 1/2 the time. The time can be shortened even more in consecutive inspections of samples arranged on a pallet.

Diverse Functions Provide 3D Analysis with a Single Unit

  Simple CT Function with High Image Quality (Optionally Available)

Simply position the compact CT unit on the fluoroscopic stage and switch the software tab to enable 3D analyses unobservable with fluoroscopic functions. There is no need to switch software programs, so CT imaging can start easily.

  Automated Calibration (Shorten the time for process before imaging by 80 %)

Calibration has been automated, simplifying CT imaging. There is no need for calibration each time a sample is loaded as previously. Imaging is started simply by selecting either [Simple], [Normal], or [Fine].

  Panoramic Imaging Function

A wide X-ray fluoroscopic image can be obtained just by specifying the imaging range on the exterior image. An improved stitching process ensures a panoramic X-ray fluoroscopic image up to 32 megapixels in size can be obtained with no conspicuous marks where the images are spliced together.

*The SMX-1000 Plus takes 395 seconds at the fastest.

  Image Adjustment Functions
(Auto Window Function and Area of Interest Function)

The contrast can be automatically optimized to make the area of interest easy to see.

Image Measurement Functions

  Ball Grid Array (BGA) Measurements

BGA bump diameters and void ratios can be measured.
With our proprietar y image proces sing algorithm, compl icated parameter set tings are unnecessary.*
Multiple settings can be saved and applicable ones can be accessed for each inspection target prior to measurement.
* Manual adjustments may be required depending on the sample.

  Area Ratio Measurements

Die bonds, solder paste wettability, and other area ratios can be measured.
The parameter settings are not required thanks to Shimadzu’s proprietary image processing algorithm.*
It is also possible to save multiple settings, and then call up the applicable settings for each inspection target prior to measurement. Furthermore, pass/fail determinations can be made based on the area ratio.
* Manual adjustments may be required depending on the sample.
* The measurement range (ROI) can be configured manually.

  Wire Sweep Ratio Measurements

The wire sweep ratio can be measured by specifying both ends of the bonding wire and the point of maximum curvature.
Pass/fail determinations can be made depending on the wire sweep ratio.

  Dimension Measurements

The Xslicer SMX-1010/1020 supports both 2-point distance and 3-point measurements.
With this system, sizes are measured efficiently by calculating calibration data internally in synchronization with the fluoroscopic magnification.

A Wealth of Functions for Facilitating Inspections

  Teaching Function

Fluoroscopic and CT imaging can be automated using the Teaching Function, which moves the sample stage to preregistered points of interest.
Additionally, for visual inspection, OK and NG judgment functions are included.

  Shortened Source-Detector Distance (SDD) Function

The distance from the X-ray generator to the X-ray detector (SDD) can be switched to 185 mm (The standard distance is 370 mm) By shortening the SDD, images with sufficient penetration can be obtained even for samples that are hard to penetrate.

  Inclined Fluoroscopy Function

The flat panel detector can be tilted up to 60 degrees. Since the detector tilts, the sample does not need to be fixed. Inclined fluoroscopy ensures that the specified sites are particularly easy to see.

• Detector not tilted
• Detector tilted 60 degrees

  Set Tracking Points Easily

If a tracking point is set, the observation position of interest when tilted and rotated never leaves the center of the window.
As a result, the point of interest is never lost.
To set a tracking point, simply tilt the detector and double click the position of interest.