Page 15 - SMX-800
P. 15

Poor Mounting Conditions of BGA Chips Can Be Checked.

            Short circuit                     Tin ball deformation              Rosin joint
            Internal Conditions of Various Samples Can Also Be Checked.

            Connector cable                   Microswitch                       SD card

            Fuse (blown)                      LED indicator light               Crystal oscillator

            Lead wire joints                  Power quality analyzer IC         Capacitor

            Lithium ion battery               Small motor for mobile phone      Optocoupler

                                                                                                Micro-focus X-Ray Inspection System  15
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